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    (EAC)OLED Film Laser Cutting Equipment
    The equipment utilizes laser to cut the entire flexible substrate (maximum size: 1500mm x 925mm) into cells of a specified size & number and then discharge them. The equipment comprises a substrate feeding unit, a laser cutting unit, a waste removal unit, a turntable unit and an unloading unit.
    Equipment Advantages
    • 01
      Synchronous cutting with multiple laser heads to improve cutting efficiency
    • 02
      Utilize ultra-short pulse laser processing to reduce damage to the product
    • 03
      The hardware is independently developed and manufactured by Maxwell, which can guarantee the delivery and be convenient for customization and upgrading
    • 04
      Independent software development, friendly interface, unique multi-matrix fusion parallel algorithm
    • 05
      Equipped with cutting dust removal and product, platform cleaning function, and excellent particle removal effect
    • 06
      Equipped with the function of rework processing of abnormal pieces
    Equipment Picture
    Basic Parameters
    • 1. Applicable products : flexible OLED
    • 2. Applicable product size : 1~13 inches(25mmx25mm~300mmx300mm)
    • 3. Tack Time : ≤ 3S (95 pcs) based on 6 inches
    • 4. CO2 laser cutting accuracy : ≤±30μm
    • 5. UV laser cutting accuracy : ≤±30μm
    • 6. Coincidence degree : ≤ ± 15μm
    • 7. GP laser cutting accuracy : ≤ ± 30μm
    • 8. CO2 cutting unilateral heat influence range : ≤70μm
    • 9. UV cutting unilateral heat influence range : ≤40μm
    • 10. Green laser cutting unilateral heat influence range : ≤20μm
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